BU

Balehithlu Manjappaiah Upendra

IA Infineon Technologies Austria Ag: 1 patents #51 of 189Top 30%
📍 Singapore, SG: #396 of 1,679 inventorsTop 25%
Overall (2021): #519,806 of 548,734Top 95%
1
Patents 2021

Issued Patents 2021

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11189592 Multi-clip structure for die bonding Dexter Reynoso 2021-11-30