Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11037856 | Semiconductor chip package comprising a leadframe connected to a substrate and a semiconductor chip, and a method for fabricating the same | Peter Scherl | 2021-06-15 |
CN
Christian Neugirg
Overall (2021): #497,223 of 548,734Top 95%
1
Patents 2021