Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11152321 | Semiconductor device having a copper pillar interconnect structure | Swee Guan Chan, Eung San Cho, Navas Khan Oratti Kalandar | 2021-10-19 |
| 10937709 | Substrates for semiconductor packages | Kheng-Jin Chan | 2021-03-02 |