Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11075351 | Packaging structure with groove | Shih-Wen Liao | 2021-07-27 |
| 11013156 | EMI shielding film and method of manufacturing the same | Sung-Chien Huang, Hsiou-Ming Liu, Ping-Feng Yu | 2021-05-18 |