Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11114387 | Electronic packaging structure | Jing-Yao Chang, Fang-Jun Leu, Wei Han, Kuo-Shu Kao | 2021-09-07 |
| 11004816 | Hetero-integrated structure | Yu-Min Lin, Ang-Ying Lin, Sheng-Tsai Wu, Wei-Chung Lo | 2021-05-11 |