Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11088135 | Electrostatic discharge protection apparatus and integrated passive device with capacitors | Yu-Hua Chung, Tai-Jui Wang | 2021-08-10 |
| 10950588 | Chip package structure and manufacturing method thereof | Cheng-Hung Yu, Tai-Jui Wang, Wei-Yuan Cheng | 2021-03-16 |
| 10941498 | Panel to be plated, electroplating process using the same, and chip manufactured from the same | Chien-Hsun Chu, Chien-Chou Tseng, Ming-Huan Yang, Tai-Jui Wang, Yu-Hua Chung | 2021-03-09 |