Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11114337 | Method for bonding and interconnecting semiconductor chips | Gaspard Hiblot, Geert Van der Plas | 2021-09-07 |
| 10903335 | Self-aligned internal spacer with EUV | Gaspard Hiblot, Sylvain Baudot, Hans Mertens | 2021-01-26 |