Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11088070 | Method of forming a multi-level interconnect structure in a semiconductor device | Vladimir Machkaoutsan, Zsolt Tokei | 2021-08-10 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11088070 | Method of forming a multi-level interconnect structure in a semiconductor device | Vladimir Machkaoutsan, Zsolt Tokei | 2021-08-10 |