TW

Tatsuro Wakimoto

IH Ihi: 1 patents #56 of 162Top 35%
UO University Public Corporation Osaka: 1 patents #1 of 22Top 5%
Overall (2021): #238,933 of 548,734Top 45%
1
Patents 2021

Issued Patents 2021

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11154809 Packing, method for manufacturing same, and liquid film-forming structure Yoshiyuki Iso, Ryosuke IKEDA, Kenji Takano, Kenji Katoh 2021-10-26