Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11140786 | Thermal interface adhesion for transfer molded electronic components | Timothy J. Chainer | 2021-10-05 |
| 10908110 | Using in situ capacitance measurements to monitor the stability of interface materials in complex PCB assemblies and other structures | Timothy J. Chainer, Edward J. Yarmchuk | 2021-02-02 |