LS

Lei Shan

IBM: 2 patents #3,096 of 11,638Top 30%
📍 Carmel, NY: #11 of 27 inventorsTop 45%
🗺 New York: #2,451 of 12,766 inventorsTop 20%
Overall (2021): #137,973 of 548,734Top 30%
2
Patents 2021

Issued Patents 2021

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
11062976 Functional stiffener that enables land grid array interconnections and power decoupling Daniel J. Friedman 2021-07-13
10892105 Multi-layer capacitor package 2021-01-12