Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11149361 | Preparation methods of high modulus carbon fiber (HMCF) and precursor (mesophase pitch (MP)) thereof | Xin Gong, Bin Lou, Jun Li, Zhihao Li, Nan Shi +14 more | 2021-10-19 |
| 10978584 | Semiconductor structure, semiconductor assembly and power semiconductor device | Jiangfeng Du, Zhenchao Li, Zhiyuan Bai, Qi Yu, Shuzhou Li | 2021-04-13 |