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Home › 2021 › IBM › Derrick Liu

Derrick Liu — 2 Patents in 2021

IBM: 2 patents #3,096 of 11,638Top 30%

Hudson, OH: #7 of 68 inventorsTop 15%

Ohio: #1,189 of 7,535 inventorsTop 20%

Overall (2021): #167,059 of 548,734Top 35%

2 Patents 2021

Issued Patents 2021

Showing 1–2 of 2 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
11195969	Method of forming a metal silicide transparent conductive electrode	Jeffrey P. Gambino, Daniel S. Vanslette	2021-12-07	$3,115,000
11056610	Method of forming a metal silicide transparent conductive electrode	Jeffrey P. Gambino, Daniel S. Vanslette	2021-07-06	$5,313,000

Derrick Liu — 2 Patents in 2021

Issued Patents 2021

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