Issued Patents 2021
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11178757 | Selective dielectric resin application on circuitized core layers | Matthew S. Kelly, Scott B. King, Joseph Kuczynski | 2021-11-16 |
| 11059120 | Non-destructive identifying of plating dissolution in soldered, plated through-hole | Matthew S. Kelly, Joseph Kuczynski, Scott B. King, Matthew S. Doyle | 2021-07-13 |
| 10982060 | Glass-free dielectric layers for printed circuit boards | Joseph Kuczynski, Jason T. Wertz, Sarah K. Czaplewski-Campbell, Jing Zhang | 2021-04-20 |
| 10959339 | Manufacturing a product using a soldering process | Andreas Huber, Harald Huels, Thomas-Michael Winkel | 2021-03-23 |
| 10932363 | Glass fiber coatings for improved resistance to conductive anodic filament formation | Matthew S. Kelly, Scott B. King, Joseph Kuczynski | 2021-02-23 |