Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11166368 | Printed circuit board and semiconductor package including the same | Jung-Ho Park, In Won O | 2021-11-02 |
| 11158124 | Method of providing 3D GIS web service | Sang Hee Shin, Seong Do SON | 2021-10-26 |
| 11127201 | Method for providing 3D GIS web services | Seong Do SON | 2021-09-21 |