Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11133128 | System in package module assembly, system in package module, and electronic device | Yuping Gong, Zhaozheng Hou | 2021-09-28 |
JW
Junhe WANG — 1 Patent in 2021
Overall (2021): #385,601 of 548,734Top 75%
1
Patents 2021