Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11111184 | Method for additive manufacturing of 3D-printed articles | Mei-Ling Ho, Li-Cheng Pan, Yin-Chih Fu, Chung-Hwan Chen, Je-Ken Chang | 2021-09-07 |
| 11115508 | Wireless communication device and case assembly | Chin-Kai Sun, Chun-Lung Chu, Tung-Hsin Yeh | 2021-09-07 |