Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11062731 | Solder bump height stabilization for micro and fine pitch electrode pads | Takuya Satoh, Hiroyasu Tsuchida, Kouji Takei | 2021-07-13 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11062731 | Solder bump height stabilization for micro and fine pitch electrode pads | Takuya Satoh, Hiroyasu Tsuchida, Kouji Takei | 2021-07-13 |