Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10900768 | Systems and methods for analysis of material properties of components and structures using machining processes to enable stress relief in the material under test | Adrian T. DeWald, Michael R. Hill, Eric Summer, Teresa Wong | 2021-01-26 |