Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11114409 | Chip on wafer on substrate optoelectronic assembly and methods of assembly thereof | Mir Ashkan Seyedi | 2021-09-07 |
| 11115130 | Wavelength control and monitor for dense wavelength division multiplexing (DWDM) silicon photonic receiver | Tsung-Ching Huang, Jinsung Youn, Peter Jin Rhim | 2021-09-07 |
| 10989878 | Multi-wavelength optical signal splitting | Raymond G. Beausoleil, Di Liang, Geza Kurczveil, Mir Ashkan Seyedi, Zhihong Huang | 2021-04-27 |
| 10895688 | Laterally mated optical connectors | Kevin B. Leigh, Paul Kessler Rosenberg, Sagi Varghese Mathai, Mir Ashkan Seyedi, Michael Renne Ty Tan +1 more | 2021-01-19 |