Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11081465 | Method for producing a stable sandwich arrangement of two components with solder situated therebetween | Michael Schäfer | 2021-08-03 |
| 11045910 | Metal paste and use thereof for joining components | Thomas Krebs, Michael Schäfer, Susanne Klaudia DUCH, Jens Nachreiner | 2021-06-29 |
| 10910340 | Silver sintering preparation and the use thereof for the connecting of electronic components | Ly May Chew, Seigi Suh, Samson Shahbazi | 2021-02-02 |