Issued Patents 2021
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11183463 | Chip package method and chip package structure | Kerui Xi, Feng Qin, Jine Liu, Tingting Cui | 2021-11-23 |
| 11103869 | Microfluidic chip and driving method thereof and analysis apparatus | Kerui Xi, Feng Qin, Jine Liu, Tingting Cui | 2021-08-31 |
| 11081506 | Display component and display device | Baiquan Lin, Kerui Xi, Junting Ouyang, Qiongqin MAO, Feng Qin +2 more | 2021-08-03 |
| 11056437 | Panel-level chip device and packaging method thereof | Kerui Xi, Feng Qin, Jine Liu, Tingting Cui | 2021-07-06 |
| 10989973 | Display panel and 3D printing device | Kerui Xi, Chen-Cheng Wang, Feng Qin, Jine Liu, Tingting Cui | 2021-04-27 |