SW

Sen Wu

GC Guangzhou Fastprint Circuit Tech Co.: 1 patents #1 of 6Top 20%
SC Shenzhen Fastprint Circuit Tech Co.: 1 patents #1 of 6Top 20%
YC Yixing Silicon Valley Electronics Tech Co.: 1 patents #1 of 4Top 25%
Overall (2021): #266,319 of 548,734Top 50%
1
Patents 2021

Issued Patents 2021

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11083091 Hole connecting layer manufacturing method, circuit board manufacturing method and circuit board Zeyang Lian, Yanguo Li, Bei Chen 2021-08-03