Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11003604 | Procedures for improving efficiency of an interconnect fabric on a system on chip | Shailendra Desai, Juan Sierra, Parimal Gaikwad, Amit Jain, Mark Pearce | 2021-05-11 |