Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11132986 | Tailored panel assembly and method of manufacturing the same | Raja K. Mishra, Jon T. Carter, Tyson W. Brown, Blair E. Carlson, David R. Sigler +2 more | 2021-09-28 |
| 11031161 | Method of manufacturing a bulk nitride, carbide, or boride-containing material | Frederick E. Pinkerton, Raja K. Mishra, Tyson W. Brown | 2021-06-08 |
| 11007713 | High throughput additive manufacturing system | John Patrick Spicer, Jason J. Nolte, Thomas A. Perry, Blair E. Carlson, HyungMin Chae +1 more | 2021-05-18 |
| 11011742 | Silicon embedded copper anodes and battery cells incorporating the same | Andrew C. Bobel, James R. Salvador, Mark W. Verbrugge | 2021-05-18 |
| 10982306 | Additive manufacturing process and powder material therefor | Andrew C. Bobel, Tyson W. Brown | 2021-04-20 |