JE

James Dean Eoff

GC Globalwafers Co.: 1 patents #36 of 81Top 45%
Overall (2021): #420,240 of 548,734Top 80%
1
Patents 2021

Issued Patents 2021

Patent #TitleCo-InventorsDate
10910280 Methods for separating bonded wafer structures Justin Scott Kayser, John F. Valley 2021-02-02