Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11081359 | Methods for polishing semiconductor substrates that adjust for pad-to-pad variance | Ichiro Yoshimura, H. J. Chiu, Sumeet S. Bhagavat, Taehyeong Kim, Norimasa Katakura +1 more | 2021-08-03 |
| 11043395 | Methods for processing semiconductor wafers having a polycrystalline finish | Alexis Grabbe, Hui Wang | 2021-06-22 |