Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11037906 | 3D IC package with RDL interposer and related method | — | 2021-06-15 |
| 11038011 | Metal-insulator-metal capacitors including nanofibers | Lili Cheng, Robert J. Fox | 2021-06-15 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11037906 | 3D IC package with RDL interposer and related method | — | 2021-06-15 |
| 11038011 | Metal-insulator-metal capacitors including nanofibers | Lili Cheng, Robert J. Fox | 2021-06-15 |