Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11102913 | Heat dissipating assembly and main board module | Chih-Ming Lai, Tzu-Hsiang Huang | 2021-08-24 |
| 11089684 | Motherboard module and electronic device | Chih-Ming Lai, Chung-Wei Chiang, Tzu-Hsiang Huang | 2021-08-10 |