Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11189323 | Heat-dissipating, shock-absorbing structure | — | 2021-11-30 |
| 10939584 | Heat dissipation module and assembly method thereof | Wei-Chung Hsiao | 2021-03-02 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11189323 | Heat-dissipating, shock-absorbing structure | — | 2021-11-30 |
| 10939584 | Heat dissipation module and assembly method thereof | Wei-Chung Hsiao | 2021-03-02 |