Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11090770 | Method of forming a component | Dheepa Srinivasan, Dayananda NARAYANA, Kaustubh Krishna Bawane, Mariusz Strzyzewski, Tomasz Michal Szewczyk +1 more | 2021-08-17 | $32,312,000 |
| 10919119 | Method for repairing a component by additive manufacturing | Dheepa Srinivasan, Debabrata Mukhopadhyay | 2021-02-16 | $36,628,000 |