Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11193047 | Electrically conductive adhesive film and dicing-die bonding film using the same | Naoaki Mihara, Jirou Sugiyama | 2021-12-07 |
| 11136479 | Electrically conductive adhesive film and dicing-die bonding film using the same | Naoaki Mihara, Jirou Sugiyama | 2021-10-05 |
| 11139261 | Film-like adhesive and method for producing semiconductor package using film-like adhesive | Minoru Morita | 2021-10-05 |
| 11066577 | Electrically conductive adhesive film and dicing-die bonding film using the same | Naoaki Mihara, Jirou Sugiyama | 2021-07-20 |