Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11164877 | Semiconductor device having void in bit line contact plug | Shi-Wei HE, Te-Hao Huang, Hsien-Shih Chu, Feng-Ming Huang | 2021-11-02 |
| 11145715 | Semiconductor structure and method of forming same | Yu-Cheng Tung, Te-Hao Huang, Hsien-Shih Chu, Feng-Ming Huang | 2021-10-12 |