Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11145615 | Solder material for semiconductor device | Hirohiko Watanabe, Shunsuke Saito, Yoshitaka Nishimura | 2021-10-12 |
| 10896892 | Wire bonding apparatus | Takashi Saito, Kazumasa Kido, Yoshitaka Nishimura | 2021-01-19 |