Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11127622 | Deep trench isolation and substrate connection on SOI | James Gordon Boyd, Ronghua Zhu | 2021-09-21 |
| 11127856 | LDMOS with diode coupled isolation ring | Xin Lin, Xu Cheng, Ronghua Zhu | 2021-09-21 |
| 10944001 | Deep trench and junction hybrid isolation | Xin Lin, Ronghua Zhu | 2021-03-09 |