Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11056457 | Semiconductor device with bond wire reinforcement structure | Boon Yew Low, Wai Yew Lo, Poh Leng Eu, Chin Teck Siong | 2021-07-06 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11056457 | Semiconductor device with bond wire reinforcement structure | Boon Yew Low, Wai Yew Lo, Poh Leng Eu, Chin Teck Siong | 2021-07-06 |