Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11035723 | Optical sensor package assembly, manufacturing method thereof and electronic devices | — | 2021-06-15 | |
| 11020094 | Method and system for processing ultrasonic imaging data | Ying Wu, Yinhui Deng, Xiaomin Li | 2021-06-01 | $1,628,000 |