Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11035723 | Optical sensor package assembly, manufacturing method thereof and electronic devices | — | 2021-06-15 |
| 11020094 | Method and system for processing ultrasonic imaging data | Ying Wu, Yinhui Deng, Xiaomin Li | 2021-06-01 |