Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10950762 | Round chip scale package and manufacturing method therefor | Jae-sik Min, Jae Yeop Lee, Byoung Gu Cho, Byoung Kwon Cho | 2021-03-16 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10950762 | Round chip scale package and manufacturing method therefor | Jae-sik Min, Jae Yeop Lee, Byoung Gu Cho, Byoung Kwon Cho | 2021-03-16 |