{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "2021", "item": "https://www.patentleaderboard.com/2021/"}, {"@type": "ListItem", "position": 3, "name": "Evapco", "item": "https://www.patentleaderboard.com/2021/company/evapco"}, {"@type": "ListItem", "position": 4, "name": "Jeff Kane", "item": "https://www.patentleaderboard.com/2021/inventor/fl:je_ln:kane-7"}]}
Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
JK

Jeff Kane — 1 Patent in 2021

EVEvapco: 1 patents #6 of 21Top 30%
Biglerville, PA: #1 of 1 inventorsTop 100%
Pennsylvania: #2,483 of 7,685 inventorsTop 35%
Overall (2021): #410,635 of 548,734Top 75%
1 Patents 2021

Issued Patents 2021

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11052614 Thermal fill bonding method Davey J. Vadder 2021-07-06