Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11015260 | Method for controlling electrochemical deposition to avoid defects in interconnect structures | Jun-Nan Nian, Shiu-Ko JangJian, Yao-Hsiang Liang, Ting-Chun Wang | 2021-05-25 |