Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11211310 | Package structures | Jen-Chih Li | 2021-12-28 |
| 10886201 | Power device having a substrate with metal layers exposed at surfaces of an insulation layer and manufacturing method thereof | Shu-Han Yang, Jai-Tai Kuo, Po-Chang Chen | 2021-01-05 |