Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11072045 | Method and structure for compensating tolerances in assembling modules | Chin-Sung Liu, Shin-Ter Tsai, Tsung-Hung Wu, Ming-Yan Lin, Chi-Ling Chang | 2021-07-27 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11072045 | Method and structure for compensating tolerances in assembling modules | Chin-Sung Liu, Shin-Ter Tsai, Tsung-Hung Wu, Ming-Yan Lin, Chi-Ling Chang | 2021-07-27 |