Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11041047 | Conductive thermoplastic polyamide molding compound | Nikolai Lamberts | 2021-06-22 |
| 10902431 | Systems and methods for monitoring and analyzing financial transactions on public distributed ledgers for suspicious and/or criminal activity | Kevin Feng, Benjamin Tyson Duranske | 2021-01-26 |
| 10889713 | Polyamide moulding compound and moulded articles produced therefrom | Christian Schubert, Botho Hoffmann | 2021-01-12 |