Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11177271 | Device, a method used in forming a circuit structure, a method used in forming an array of elevationally-extending transistors and a circuit structure adjacent thereto | Paolo Tessariol, Justin B. Dorhout, Indra V. Chary, Jun Fang, Matthew Park +4 more | 2021-11-16 | $19,987,000 |
| 11040377 | Packaging concept for solid products | Gregory Scott Conrad, Sarah Gilbertson, Scott R. Limback, Gretchen King, Jeffrey Michael Schultz +2 more | 2021-06-22 | $49,670,000 |