Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11088123 | Package system having laterally offset and ovelapping chip packages | Ronen Sinai | 2021-08-10 |
| 11004778 | Polygonal BGA semiconductor package | William B. Weiser | 2021-05-11 |