Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11156796 | Optical sensor package module | — | 2021-10-26 |
| 10964839 | Manufacturing method of sensor chip package structure | — | 2021-03-30 |
| 10896983 | Optical component packaging structure | Yi-Chang Chang, Yen-Hsin Chen | 2021-01-19 |