Issued Patents 2021
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11168977 | Thickness measuring apparatus | Nobuyuki Kimura | 2021-11-09 |
| 11165408 | Method of manufacturing substrate for acoustic wave device | Jun Abatake, Kenya Kai, Kentaro Shiraga | 2021-11-02 |
| 11154952 | Laser processing apparatus | Yuji HADANO | 2021-10-26 |
| 11137358 | Testing system | Taiki Sawabe | 2021-10-05 |
| 11090762 | Laser processing apparatus | Yuji HADANO, Masatoshi Nayuki | 2021-08-17 |
| 11090766 | Laser processing apparatus | Masatoshi Nayuki | 2021-08-17 |
| 11088674 | Saw filter manufacturing method and saw filter | Jun Abatake | 2021-08-10 |
| 11065717 | Laser processing apparatus | Yuji HADANO, Masatoshi Nayuki | 2021-07-20 |
| 11054246 | Thickness measuring apparatus | Nobuyuki Kimura | 2021-07-06 |
| 11032456 | Ultrafast imaging apparatus | Yusaku Ito | 2021-06-08 |
| 11027371 | Laser applying mechanism | — | 2021-06-08 |
| 11015919 | Thickness measuring apparatus | Nobuyuki Kimura | 2021-05-25 |
| 11007605 | Laser processing apparatus | Yuji HADANO, Masatoshi Nayuki | 2021-05-18 |
| 10978318 | Laser processing apparatus | Yuji HADANO, Masatoshi Nayuki | 2021-04-13 |
| 10955233 | Thickness measuring apparatus | Nobuyuki Kimura | 2021-03-23 |
| 10940560 | Laser processing apparatus | Yuji HADANO, Masatoshi Nayuki | 2021-03-09 |
| 10890433 | Interferometric thickness measuring apparatus using multiple light sources coupled with a selecting means | Nobuyuki Kimura | 2021-01-12 |