Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11034623 | Thermal conductive member and heat dissipation structure including the same | Saori INOUE, Toshitaka Yamagata, Ryo Yoshimatsu, Ryuji Koga | 2021-06-15 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11034623 | Thermal conductive member and heat dissipation structure including the same | Saori INOUE, Toshitaka Yamagata, Ryo Yoshimatsu, Ryuji Koga | 2021-06-15 |