Issued Patents 2021
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11133235 | Heat-dissipating semiconductor package including a plurality of metal pins between first and second encapsulation members | Jie Song, Xiaofeng Xu | 2021-09-28 |
| 11121110 | Packaging process and packaging structure | Chien-Ming Chen | 2021-09-14 |
| 11081461 | Packaging process and packaging structure | Chien-Ming Chen | 2021-08-03 |
| 10910303 | Package structure and manufacturing method thereof | Xiaofeng Xu | 2021-02-02 |
| 10892205 | Package structure and power module using same | — | 2021-01-12 |