Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11178751 | Printed circuit board having vias arranged for high speed serial differential pair data links | Vijendera Kumar, Sanjay Kumar, Mallikarjun Vasa, Bhyrav M. Mutnury | 2021-11-16 |